Mounting circuit substrate

ABSTRACT

A semiconductor package containing a field effect transistor (FET) used in a high frequency band includes a mounting circuit substrate on which the semiconductor device is mounted. The mounting circuit substrate has a gate wiring conductor, a drain wiring conductor, and a source wiring conductor, which are connected to the gate electrode, the drain electrode, and the source electrode, respectively, of the semiconductor device. The gate wiring conductor and the drain wiring conductor extend toward each other so that their adjacent or facing ends are in close proximity to each other, thereby increasing the capacitance between the gate wiring conductor and the drain wiring conductor.

FIELD OF THE INVENTION

The present invention relates to a mounting circuit substrate, and moreparticularly to a mounting circuit substrate on which a high frequencysemiconductor device is mounted.

BACKGROUND ART

Various techniques for high frequency applications have been known, asdisclosed, for example, in Japanese Laid-Open Patent Publication Nos.8-139107 (1996), 6-61365 (1994), and 1-273404 (1989).

In high frequency applications, the electrical characteristics of thesemiconductor devices are significantly affected by their operatingfrequency, which may cause various problems. In order to address suchproblems, different techniques have been studied, including thosedisclosed in the above three publications. Specifically, the firstpublication discloses a semiconductor device package construction, thesecond publication discloses a semiconductor chip mounting method, andthe third publication discloses the construction of a high frequencycircuit including matching circuits.

High frequency semiconductor devices are generally mounted on mountingcircuit substrates when used in practical applications. Each portion ofa mounting circuit substrate (e.g., wiring patterns) usually has aconfiguration determined in accordance with the specifications of thesemiconductor device to be mounted on the substrate.

A problem associated with high frequency semiconductor devices is thatthe power gain decreases as the operating frequency increases. In thisconnection, the present inventor has found that there is still room forimprovement in the construction of mounting circuit substrates toimprove the high frequency characteristics of the semiconductor devicemounted thereon.

SUMMARY OF THE INVENTION

The present invention has been made to solve the above problems. It is,therefore, an object of the present invention to provide a mountingcircuit substrate on which a high frequency semiconductor device ismounted and which is configured to improve the power gaincharacteristics of the high frequency semiconductor device.

According to a first aspect of the present invention, amounting circuitsubstrate including: a substrate body, a gate wiring conductor and adrain wiring conductor.

The substrate body has a surface having a mounting region on which ahigh frequency semiconductor device is mounted.

The gate wiring conductor has a connecting portion at which the gatewiring conductor is electrically connected to a gate electrode of thehigh frequency semiconductor device, the connecting portion beinglocated in the mounting region of the substrate body.

The drain wiring conductor has a connecting portion at which the drainwiring conductor is electrically connected to a drain electrode of thehigh frequency semiconductor device, the connecting portion beinglocated in the mounting region of the substrate body and spaced apredetermined distance from an edge of the connecting portion of thegate wiring conductor.

A capacitance between the connecting portion of the gate wiringconductor and the connecting portion of the drain wiring conductorresonates with the LC components in the high frequency semiconductordevice so that the power gain vs. frequency characteristic curve of thehigh frequency semiconductor device has a hump at a frequency in theoperating frequency band of the high frequency semiconductor device.

Thus, the mounting circuit substrate of the present invention isconfigured such that the capacitance between the gate and drain wiringconductors resonates with the LC components in the high frequencysemiconductor device mounted on the substrate, thereby improving thepower gain of the device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a mounting circuit substrate accordingto a first embodiment of the present invention and a semiconductordevice mounted thereon.

FIG. 2 is a plan view showing the surface configuration of the mountingcircuit substrate of the first embodiment.

FIG. 3 is a diagram illustrating the effect of the construction of themounting circuit substrate.

FIG. 4 is a plan view showing the configuration of a mounting circuitsubstrate according to the second embodiment of the present invention.

FIG. 5 is a plan view showing the configuration of a mounting circuitsubstrate according to the third embodiment of the present invention.

FIG. 6 is a plan view showing the configuration of a mounting circuitsubstrate according to the fourth embodiment of the present invention.

FIG. 7 is a cross-sectional view showing the configuration of a mountingcircuit substrate according to a fifth embodiment of the presentinvention.

FIG. 8 shows a configuration of a comparative example.

FIG. 9 shows a configuration of a comparative example.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

FIG. 1 is a perspective view of a mounting circuit substrate 10according to a first embodiment of the present invention and asemiconductor device 30 mounted thereon. The semiconductor device 30 isa semiconductor package containing a field effect transistor (FET) andmore specifically is a high frequency semiconductor device used in ahigh frequency band. The mounting circuit substrate 10 is a mountingcircuit substrate for use with a high frequency semiconductor device andis adapted to have the semiconductor device 30 mounted thereon. Themounting circuit substrate 10 has a gate wiring conductor 12, a drainwiring conductor 14, and a source wiring conductor 16, which areconnected to a gate electrode 20, a drain electrode 24, and sourceelectrodes 22 and 23, respectively, of the semiconductor device 30. Whenthe gate and drain electrodes of the semiconductor device 30 are used asinput and output electrodes, respectively, the gate wiring conductor 12and the drain wiring conductor 14 of the mounting circuit substrate 10serve as input and output wiring conductors, respectively.

FIG. 2 is a plan view showing the surface configuration of the mountingcircuit substrate 10 of the first embodiment as viewed through thesemiconductor device 30 (i.e., without showing the semiconductor device30 except for its electrodes). In FIG. 2, the dashed line 32schematically indicates the region of the substrate surface on which thesemiconductor device 30 is mounted. This region, enclosed within anddefined by the dashed line 32, is hereinafter referred to as the“mounting region 32,” for convenience. In FIG. 2, the gate electrode 20,the source electrodes 22 and 23, and the drain electrode 24 of thesemiconductor device 30 are shown to partially overlap the mountingregion 32.

The following describes the characteristic construction of the mountingcircuit substrate 10 of the first embodiment and the effect resultingfrom this construction with reference to FIGS. 1 to 3 and with referenceto the construction of the comparative mounting circuit substrate 210shown in FIGS. 8 and 9, for convenience. The comparative mountingcircuit substrate 210 shown in FIGS. 8 and 9 has a gate wiring conductor212, a source wiring conductor 216, and a drain wiring conductor 214.The comparative substrate 210 is similar to the mounting circuitsubstrate 10 in this respect (i.e., having gate, source, and drainwiring conductors). However, the distance between the facing or adjacentends of the gate wiring conductor 212 and the drain wiring conductor 214is greater than that between the facing or adjacent ends of the gatewiring conductor 12 and the drain wiring conductor 14 of the mountingcircuit substrate 10. It should be noted that FIG. 9 is across-sectional view of the comparative substrate 210 of FIG. 8 taken ina plane perpendicular to the plane of the paper. However, the sourceelectrode 22, etc. of the semiconductor device 30 are omitted from FIG.9 for convenience of illustration. In FIG. 9, the reference numeral 160denotes a cavity containing air.

FIG. 3 is a diagram illustrating the effect of the construction of themounting circuit substrate 10. Specifically, FIG. 3 shows the power gain(S21 in dB) vs. frequency characteristics (or RF characteristics) of thesemiconductor device 30 when it is mounted on the mounting circuitsubstrate 10 of the present embodiment and when it is mounted on thecomparative substrate 210 shown in FIGS. 8 and 9. As shown in FIG. 3,the power gain (S21) of the semiconductor device 30 mounted on thecomparative substrate 210 gradually decreases as its operating frequencyincreases. In the case of the mounting circuit substrate 10 of thepresent embodiment, on the other hand, the power gain (S21) of thesemiconductor device 30 mounted thereon does not substantially decreaseas its operating frequency increases; the power gain curve shows a humpat a frequency in a high frequency band. Thus, the power semiconductordevice 30 exhibits improved power gain characteristics at highfrequencies when it is mounted on the mounting circuit substrate 10 ascompared to when it is mounted on the comparative substrate 210.

The prevent inventor has found that this improvement in the power gaincharacteristics of the semiconductor device at high frequencies resultsfrom the fact that the substrate-side capacitance of the mountingcircuit substrate 10 is greater than that of the comparative substrate210. Therefore, the inventor has further studied the power gainincreasing effect of such substrate constructions (which effect isrepresented by a hump in the power gain curve of the semiconductordevice) in order to improve the characteristics of the semiconductordevice.

This hump in the power gain curve results from the resonance of the LCcomponents in the semiconductor device 30 with the capacitancecomponents of the wiring conductors on the mounting circuit substrate10. That is, the term “substrate-side capacitance” as used above meansthe capacitance components of the wiring conductors on the mountingcircuit substrate 10 as seen by the semiconductor device. The presentinventor has found, through experiment, that the hump in the power gaincurve is predominantly affected or determined by the capacitance betweenthe gate and drain wiring conductors although the capacitance betweenthe gate and source wiring conductors and that between the drain andsource wiring conductors are consider to have some impact. It should benoted that the term “LC components in the semiconductor device” as usedabove means the inductance and capacitance components of the parts(e.g., transistors, wires, leads, etc.) in the semiconductor device 30.These LC components are significantly large at the high frequencies atwhich the semiconductor device operates. Therefore, the substrate-sidecapacitance of the mounting circuit substrate 10 may be adjusted inaccordance with the values of the LC components of the semiconductordevice 30 to intentionally produce a hump in the power gain curve of thesemiconductor device 30 at a frequency in the desired frequency band andthereby improve the power gain characteristics as desired. This methodallows the power gain characteristics of the semiconductor device 30 tobe improved by changing the configuration of the mounting circuitsubstrate 10 without changing the semiconductor device structure orpackage structure of the semiconductor device 30.

As described above, the substrate-side capacitance is predominantlyaffected or determined by the capacitance between the gate wiringconductor 12 and the drain wiring conductor 14 of the mounting circuitsubstrate 10. Therefore, to obtain the desired power gaincharacteristics of the semiconductor device 30, the substrate-sidecapacitance may be optimized by changing the configurations of the gatewiring conductor 12 and the drain wiring conductor 14 of the mountingcircuit substrate 10.

In the first embodiment, the gate wiring conductor 12 and the drainwiring conductor 14 extend toward each other so that their adjacent orfacing ends are in close proximity to each other, as shown in FIG. 1,thereby increasing the capacitance between the gate wiring conductor 12and the drain wiring conductor 14. In conventional mounting circuitsubstrates such as the comparative substrate 210, the gate and drainwiring conductors extend to under the gate and drain electrodes,respectively, of the semiconductor device so that their adjacent orfacing ends are located right under (and in contact with) theseelectrodes, respectively. In the mounting circuit substrate 10 of thefirst embodiment, on the other hand, the gate wiring conductor 12 andthe drain wiring conductor 14 extend beyond (and contact with) the gateelectrode 20 and the drain electrode 24, respectively, of thesemiconductor device 30, as shown in FIG. 2.

In the present embodiment shown in FIG. 2, two source wiring conductorsare disposed on opposite sides of an imaginary line extending along thelengths of the gate and drain wiring conductors so that these sourcewiring conductors have facing ends. In this configuration, the distancebetween the gate and drain wiring conductors is smaller than thatbetween the source wiring conductors.

The following should be noted: the mounting region 32 of the firstembodiment described above corresponds to the mounting region of theinvention described in the Summary of the Invention section; the gatewiring conductor 12 corresponds to the gate wiring conductor of theinvention; and the drain wiring conductor 14 corresponds to the drainwiring conductor of the invention.

It should be noted that although in the first embodiment the mountingcircuit substrate has four wiring conductors extending on its mountingregion 32, it is to be understood that the present invention is notlimited to this particular arrangement. In other embodiments, themounting circuit substrate may have any suitable number of wiringconductors disposed in any suitable arrangement (i.e., not limited to asymmetrical arrangement such as shown in FIG. 2). Further, the widthsand shapes of these wiring conductors may not be uniform as shown inFIG. 2.

Second Embodiment

In the mounting circuit substrate of the first embodiment, the gatewiring conductor 12 and the drain wiring conductor 14 extend toward eachother so that their adjacent or facing ends are in close proximity toeach other, thus increasing the capacitance between the gate wiringconductor 12 and the drain wiring conductor 14. In addition to thisarrangement, the capacitance between the gate wiring conductor 12 andthe drain wiring conductor 14 may be further increased by increasing theelectrode facing area (or the area of overlap of the gate and drainwiring conductors). The mounting circuit substrate of a secondembodiment of the present invention differs from that of the firstembodiment in that it has a larger electrode facing area to furtherimprove the power gain of the semiconductor device.

The term “electrode facing area” as used herein means the area ofoverlap of the facing portions (or facing ends) of the gate and drainwiring conductors. The capacitance C between the gate and drain wiringconductors may be expressed as C=∈*S/d, where S is the electrode facingarea, ∈ is the dielectric constant of the material between the facingportions of the gate and drain wiring conductors, and d is the distancebetween the facing portions. Since the gate and drain wiring conductorsare located on the mounting circuit substrate 10, these wiringconductors are separated by air. Therefore, in this case, ∈ may beassumed to be equal to the dielectric constant of air for simplicity,although the dielectric constant of the substrate body of the mountingcircuit substrate 10 has a significant impact on the value of ∈.Further, the construction of the second embodiment is similar to that ofthe first embodiment, except for the configurations of the gate anddrain wiring conductors.

FIG. 4 is a plan view showing the configuration of a mounting circuitsubstrate 50 according to the second embodiment of the presentinvention. In the second embodiment, the gate wiring conductor 52 has awide portion 53 and the drain wiring conductor 54 has a wide portion 55,thereby increasing the electrode facing area and hence the capacitancebetween the gate wiring conductor 52 and the drain wiring conductor 54.

It should be noted that although in the second embodiment the wideportions 53 and 55 are rectangular in shape, it is to be understood thatthe present invention is not limited to this particular shape. In otherembodiments, the wide portions may widen gradually or stepwise towardthe facing edges.

Third Embodiment

FIG. 5 is a plan view showing the configuration of a mounting circuitsubstrate 70 according to a third embodiment of the present invention.The mounting circuit substrate 70 of the third embodiment has itselectrode facing area increased in a different manner than thatdescribed in connection with the second embodiment. Specifically, in thethird embodiment, the facing ends of the gate wiring conductor 72 andthe drain wiring conductor 74 have a dogleg shape, as shown in FIG. 5,resulting an increase in the facing areas of the gate wiring conductor72 and the drain wiring conductor 74. The gate wiring conductor 72 andthe drain wiring conductor 74 shown in FIG. 5 may be regarded as havingboth convex and concave portions.

Fourth Embodiment

FIG. 6 is a plan view showing the configuration of a mounting circuitsubstrate 110 according to a fourth embodiment of the present invention.The mounting circuit substrate 110 of the fourth embodiment has itselectrode facing area increased in a different manner than thosedescribed in connection with the second and third embodiments.Specifically, in the fourth embodiment, the gate wiring conductor 112has a comb portion 113 and the drain wiring conductor 114 has a combportion 115, as shown in FIG. 6. This results in an increase in thefacing areas of the gate wiring conductor 112 and the drain wiringconductor 114, since the comb portion 113 of the gate wiring conductor112 is interdigitated with the comb portion 115 of the drain wiringconductor 114.

It should be noted that although in the fourth embodiment the combportions 113 and 115 each have two teeth and these teeth areinterdigitated with each other, it is to be understood that the presentinvention is not limited to this particular arrangement. Theinterdigitated comb portions may have more teeth. Further, although inthe present embodiment the teeth of the comb portions are rectangular inshape, in other embodiments they may be of a triangular or curved shapeand may still be interdigitated with each other. This also results in anincrease in the facing areas of the gate wiring conductor 112 and thedrain wiring conductor 114.

Fifth Embodiment

FIG. 7 is a cross-sectional view showing the configuration of a mountingcircuit substrate 150 according to a fifth embodiment of the presentinvention. Thus, FIG. 7 shows a cross-section corresponding to those ofthe mounting circuit substrates of FIGS. 2 to 6 taken in a planeperpendicular to the plane of FIGS. 2 to 6. It should be noted that thesource electrode 22, etc. of the semiconductor device 30 are omittedfrom FIG. 7 for convenience of illustration.

The mounting circuit substrate 150 of the fifth embodiment has itselectrode facing area increased in a different manner than thosedescribed in connection with the second and fourth embodiments.Specifically, in the fifth embodiment, the drain wiring conductor 154extends within the substrate under and along the gate wiring conductor152, as shown in FIG. 7. Thus, the gate wiring conductor 152 and thedrain wiring conductor 154 are spaced only a short distance from eachother in the direction of the thickness of the substrate, therebyincreasing the electrode facing area (i.e., the area of overlap of thegate wiring conductor 152 and the drain wiring conductor 154). It shouldbe noted that the reference numeral 160 denotes a cavity containing air.Further, in the mounting circuit substrate 150 of the fifth embodiment,the material of the substrate body fills the space between the gatewiring conductor 152 and the drain wiring conductor 154. Therefore, inthe fifth embodiment, the capacitance C between the gate and drainwiring conductors may be expressed as C=∈*S/d, where S is the electrodefacing area, d is the distance between the facing portions of the gateand drain wiring conductors, and ∈ is the dielectric constant of thematerial of the substrate body (or base material) of the mountingcircuit substrate 150.

It will be noted that in the fifth embodiment the drain wiring conductor154 extends within the substrate body of the mounting circuit substrate150 such that the gate wiring conductor 152 overlaps, withoutcontacting, the drain wiring conductor 154 when viewed from the topsurface of the mounting circuit substrate 150.

It should be noted that the configuration of the fifth embodiment may becombined with the configurations of the first to fourth embodiments.

Obviously many modifications and variations of the present invention arepossible in the light of the above teachings. It is therefore to beunderstood that within the scope of the appended claims the inventionmay by practiced otherwise than as specifically described.

The entire disclosure of a Japanese Patent Application No. 2009-232638,filed on Oct. 6, 2009 including specification, claims, drawings andsummary, on which the Convention priority of the present application isbased, are incorporated herein by reference in its entirety.

1. A circuit comprising: a high frequency semiconductor device having agate electrode, a source electrode, and a drain electrode; a substratebody having a top surface having a mounting region on which said highfrequency semiconductor device is mounted; a gate wiring conductorhaving a connecting portion at which said gate wiring conductor iselectrically connected to said gate electrode of said high frequencysemiconductor device, said connecting portion of said gate wiringconductor being located in said mounting region of said substrate body;and a drain wiring conductor having a connecting portion at which saiddrain wiring conductor is electrically connected to said drain electrodeof said high frequency semiconductor device, said connecting portion ofsaid drain wiring conductor being located in said mounting region ofsaid substrate body and spaced a predetermined distance from an edge ofsaid connecting portion of said gate wiring conductor, whereincapacitance between said connecting portion of said gate wiringconductor and said connecting portion of said drain wiring conductorresonates with reactive electrical components of said high frequencysemiconductor device so that power gain as a function of frequency ofsaid high frequency semiconductor device has a hump at a frequency in anoperating frequency band of said high frequency semiconductor device. 2.The circuit according to claim 1, further comprising: a first sourcewiring conductor having a connecting portion at which said first sourcewiring conductor is electrically connected to said source electrode ofsaid high frequency semiconductor device, said connecting portion ofsaid first source wiring conductor being located in said mounting regionof said substrate body; and a second source wiring conductor having aconnecting portion at which said second source wiring conductor iselectrically connected to said source electrode of said high frequencysemiconductor device, said connecting portion of said second sourcewiring conductor being located in said mounting region of said substratebody and facing said connecting portion of said first source wiringconductor across an imaginary line that extends from said connectingportion of said gate wiring conductor to said connecting portion of saiddrain wiring conductor, wherein distance between said edge of saidconnecting portion of said gate wiring conductor and an adjacent edge ofsaid connecting portion of said drain wiring conductor is smaller thandistance between said first and second source wiring conductors.
 3. Thecircuit according to claim 1, wherein a facing portion of said gatewiring conductor faces a facing portion of said drain wiring conductor,and at least one of said facing portions of said gate and drain wiringconductors has a widened portion.
 4. The circuit according to claim 1,wherein: a facing portion of said connecting portion of said gate wiringconductor faces a facing portion of said connecting portion of saiddrain wiring conductor; and one of said facing portions of saidconnecting portions of said gate and drain wiring conductors has aconvex portion, and the other of said facing portions has a concaveportion corresponding to said convex portion.
 5. The circuit accordingto claim 4, wherein said facing portions of said connecting portions ofsaid gate and drain wiring conductors include one of comb portions anddogleg portions interdigitated or engaged with each other.
 6. Thecircuit according to claim 1, wherein one of said gate and drain wiringconductors includes an internal wiring conductor portion connected tosaid connecting portion of one of said gate and drain wiring conductorsand extending within said substrate body toward the other of said gateand drain wiring conductors.
 7. The circuit according to claim 6,wherein said internal wiring conductor portion extends within saidsubstrate body toward said other of said gate and drain wiringconductors such that said connecting portion of said other of said gateand drain wiring conductors overlaps, without contacting, said internalwiring conductor portion when viewed from said top surface of saidsubstrate body.